http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109856706-B

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2019-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109856706-B
titleOfInvention Method for manufacturing quartz surface anti-reflection layer by using metal-induced self-mask etching process
abstract The present disclosure provides a method for fabricating a quartz surface anti-reflection layer using a metal induced self-mask etching process, comprising: step S100, etching a metal material and a quartz substrate by utilizing a mixed gas reactive ion containing fluorine-based gas, and sputtering metal on the surface of quartz to form a non-volatile metal fluoride; step S200, the etching product fluorocarbon polymer is gathered around the metal fluoride to form a micro mask; and step S300, simultaneously etching the micro mask and the quartz substrate to form the sub-wavelength structure anti-reflection layer. According to the micro-mask, the metal is sputtered on the quartz surface to form the non-volatile metal fluoride, so that the etching resistance of the micro-mask is improved, a deeper sub-wavelength structure can be obtained on the quartz surface, the requirement of an anti-reflection layer can be met, meanwhile, the manufacturing process is simple, the cost is low, the large-area manufacturing can be realized rapidly, and the wide application is facilitated.
priorityDate 2019-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 46.