| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67259 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67748
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67219
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cfd838a9e20bf7abc62a040cecd3d36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44c93ecba563c2fa142e7478668cd73b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_025f185987f8f05fa449ee9b18fd62ab |
| publicationDate |
2019-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109794845-A |
| titleOfInvention |
Method, cleaning method, and processing system for processing semiconductor wafers |
| abstract |
Some embodiments of the present disclosure provide a method of processing a semiconductor wafer. The above method includes transferring semiconductor wafers from an interface tool to a chemical mechanical polishing tool. The above method also includes grinding the semiconductor wafer in a chemical mechanical polishing tool. The above method also includes transferring the semiconductor wafer from the chemical mechanical polishing tool back to the interface tool. In addition, the above method includes converting a mixed liquid into a spray, and after the semiconductor wafer is polished by the chemical mechanical polishing tool, the spray is discharged onto the semiconductor wafer in the interface tool. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113857556-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112828760-A |
| priorityDate |
2017-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |