Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32568 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02219 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
filingDate |
2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2d2e7982c114dc313e957f439abccd3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35dd8d4c5b1ad6b0cc60b820c87def93 |
publicationDate |
2018-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-108735598-A |
titleOfInvention |
etching method |
abstract |
The present invention provides a technique of anisotropic etching capable of satisfactorily forming a three-dimensional pattern. In one embodiment, a method for etching an object to be processed is provided. The object to be processed includes a supporting substrate and a processed layer, the processed layer is arranged on the main surface of the supporting substrate and includes a plurality of convex regions, and the plurality of convex regions respectively extend above the main surface, and the respective end faces of the plurality of convex regions It is exposed when viewed from the main face. The method includes: a first step of forming a film on each end face of a plurality of convex regions; a second step of anisotropically etching the film formed by the first step to selectively expose one or more end faces; and The end faces exposed in the second step are subjected to a third step of anisotropic etching for each atomic layer, wherein the layer to be processed contains silicon nitride and the film contains silicon oxide. |
priorityDate |
2017-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |