| abstract |
The present invention relates to a high heat resistance and low dielectric polysilsesquioxane resin composition applicable to liquid crystal displays, organic light emitting diodes, touch panels, electronic paper, flexible displays, etc. resist composition. More specifically, the present invention relates to a black resist composition for light-shielding with high heat resistance and low dielectric properties, comprising: 1) polysilsesquioxane containing a polar heterocyclic structure and curable by ultraviolet rays alkane random copolymer resin composition; 2) a carbon black dispersion that is coated by dispersion coating with the polysilsesquioxane resin; 3) a photoinitiator. Compared with conventional acrylic or cardo-based black resists, the black resist resin composition of the present invention has excellent heat resistance and no decrease in optical density (OD) even in high-temperature post-processes of 350 degrees or higher , and can meet the low dielectric characteristics at the same time. |