Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4694 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-1053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
filingDate |
2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-108695176-B |
titleOfInvention |
Package and method of forming the same |
abstract |
A method includes: forming a plurality of dielectric layers; forming a plurality of redistribution lines in the plurality of dielectric layers; etching the plurality of dielectric layers to form openings; filling the openings to form penetrations through the Dielectric vias of a plurality of dielectric layers; forming a dielectric layer over the dielectric vias and the plurality of dielectric layers; forming a plurality of bond pads in the dielectric layer; A first device die is bonded to the dielectric layer and a first portion of the plurality of bond pads; and a die stack is bonded to a through silicon via in the first device die. Embodiments of the invention also relate to packages and methods of forming the same. |
priorityDate |
2017-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |