| abstract |
A chemical mechanical polishing composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, wherein the particles are cocoon-like, (B) a nonionic surfactant, (C) a carbonate or bicarbonate , (D) alcohol, and (M) aqueous medium. Also provided is a method of preparing a semiconductor device comprising chemical mechanical polishing of a substrate used in the semiconductor industry in the presence of a CMP composition, and use of the CMP composition. |