Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15151 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
filingDate |
2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2022-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-106672888-B |
titleOfInvention |
Method and device for packaging an integrated circuit die |
abstract |
The present invention relates to methods and devices for packaging integrated circuit dies. A package substrate with openings and through-substrate interconnect structures is attached to a temporary carrier such as an adhesive film. The active surface of the IC die is placed in contact with the carrier substrate within the opening to temporarily attach the die to the carrier substrate. Another die is attached to the side of the first die furthest from the carrier substrate. According to an embodiment, the two dies are attached to each other using epoxy such that their respective non-active surfaces face each other. Bond wires are connected between the interconnects at the active surface of the second die and the package substrate. The leads are then packaged. After removal of the carrier substrate, a build-up interconnect structure is formed that includes external interconnects of the package substrate (eg, solder balls of a ball grid array package). |
priorityDate |
2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |