| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106463392-B |
| titleOfInvention |
Cooling mandrel with thermal management for dicing during plasma dicing |
| abstract |
Methods and apparatus are described for dicing semiconductor wafers, wherein each wafer has a plurality of integrated circuits. In an example, the plasma etch chamber includes a plasma source disposed in an upper region of the plasma etch chamber. The plasma etch chamber also includes a cathode assembly disposed below the plasma source. The cathode assembly includes a cooled RF powered chuck for supporting the inner portion of the backside of the substrate carrier. The cathode assembly also includes a cooling RF isolated support surrounding but isolated from the RF powered chuck. The RF isolated support is used to support the outer portion of the backside of the substrate carrier. |
| priorityDate |
2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |