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filingDate 2016-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1320236d6303968c72e5a24fbda4dea8
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publicationDate 2016-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106206596-A
titleOfInvention Method for manufacturing split-gate flash memory device
abstract The invention provides a method for manufacturing a split-gate flash memory device. By adding at least one gas among hydrogen, nitrogen and fluorine-based gases in the oxygen plasma ashing process after etching the silicon nitride layer of the floating gate, the floating The photoresist layer used for etching the gate silicon nitride layer will simultaneously remove the polymer residue attached to the sidewall of the floating gate silicon nitride layer, thereby eliminating the impact of the polymer residue on the etching of the subsequent floating gate polysilicon layer. The adverse effects of the etching process can be obtained to obtain the height of the tip of the floating gate that meets the requirements, thereby avoiding the formation of the reverse tip of the polysilicon layer of the word line, and improving the programming crosstalk failure problem caused by the reverse tunneling phenomenon.
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