http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106024618-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3343 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49815 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32449 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4412 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45591 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate | 2009-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106024618-B |
| titleOfInvention | The nozzle component of heating |
| abstract | In general the present invention includes the nozzle component of heating, can be used to supplying process gas to processing chamber housing.The processing chamber housing can be etching chamber.When the processing gas is discharged from the processing chamber housing, the uniform treatment substrate can be difficult.The processing gas is detached into the substrate and towards when vacuum pump push, the plasma on substrate may be uneven in the case where etching.Non-uniform plasma can cause uneven etching.In order to avoid uneven etching, which can be divided into two regions, each region all have can the gas of independent control import and temperature control.The first area corresponds to the edge of the substrate, and the second area corresponds to the center of the substrate.By independent control temperature and by the air-flow of the showerhead region, the etch uniformity of the substrate can be increased. |
| priorityDate | 2008-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 |
Total number of triples: 25.