http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105762117-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 |
| filingDate | 2016-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105762117-B |
| titleOfInvention | A staggered stacked three-dimensional packaging structure of LTCC substrate |
| abstract | The invention provides a staggered stacked three-dimensional packaging structure of LTCC substrates, including a bottom LTCC substrate, an intermediate LTCC substrate and a top LTCC substrate, the intermediate LTCC substrate includes at least two layers, and each LTCC substrate is provided with a chip cavity. The LTCC substrate is arranged alternately in the upper and lower layers of a ladder, and the bottom layer, the middle layer and the top layer of the LTCC substrate are electrically connected through gold wires or gold strips, and the mechanical support and common ground connection are realized through conductive adhesive paste; the present invention adopts multiple traditional LTCC substrates are staggered and stacked to achieve a three-dimensional packaging structure. The dislocation electrical connection area of each layer is staggered by adjacent layers, and some areas can be vacated to place larger-sized auxiliary devices; using conventional LTCC substrate processing technology, gold wire and gold ribbon bonding technology It can be realized by bonding technology with conductive adhesive, the process is simple, and it has the characteristics of high mechanical strength, large contact area of adjacent layers, and small circuit volume. |
| priorityDate | 2016-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.