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filingDate 2011-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105751540-B
titleOfInvention Heating plates with flat heater zones for semiconductor processing
abstract A heating plate for a substrate support assembly in a semiconductor processing apparatus, comprising a plurality of independently controllable planar heater zones arranged in a scalable multiplex arrangement, and independently controlling and heating the planar heater zones electronics that provide power to the device area. Each planar heater zone includes one or more heater elements made of an insulator-conductor composite. A substrate support assembly containing a heating plate includes electrostatic clamping electrodes and a temperature-controlled substrate. The method of making the heating plate includes bonding together ceramic plates having planar heater areas, power supply lines, power return lines and through holes.
priorityDate 2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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