| abstract |
The embodiment provides a kind of connected structures and forming method thereof.Conductive layer is formed on the first surface of connected structure, connected structure includes the first substrate for being bonded to the second substrate, and the first surface of connected structure is the surface of the exposure of the first substrate.The patterned mask with the first opening and the second opening, a part of the first opening and the second opening exposure conductive layer are formed on the electrically conductive.The first part of the first joint connections is formed in the first opening, and forms the first part of the second joint connections in the second opening.Patterned conductive layer is to form the second part of the first joint connections and the second part of the second joint connections.Connected structure is bonded to third substrate using the first joint connections and the second joint connections. |