http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105567105-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate | 2015-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105567105-B |
| titleOfInvention | High index of refraction wafer-level package LED white chips fluorescent coating and preparation method |
| abstract | The invention discloses high index of refraction wafer-level package LED white chips fluorescent coating and preparation method, step to be：Cassette platinum is catalyzed methyl phenyl vinyl polysiloxane and single hydrogen end-blocking PSI reacts to obtain pectination methyl phenyl vinyl polysiloxane, add α, ω double hydrogen end-blocking PSI, methyl phenyl vinyl polysiloxane, LED fluorescent powder, inhibitor, tackifier and methyl and phenyl hydrogen-containing silicon oils are mixed, and the high index of refraction wafer-level package LED white chip fluorescent coatings that thickness is 70 microns 700 microns are obtained through vacuum pressing-combining.The glued membrane is applied to the encapsulation of encapsulation chip-scale white light LEDs.The inventive method is simple, is a kind of green process for producing not using solvent；Fluorescent coating thickness evenness is very good, it is entirely avoided fluorescent material settles, and glued membrane normal temperature storage time length, hardness is high after glued membrane solidification so that the lot stability of flip LED white chip is high, and colour temperature is consistent. |
| priorityDate | 2015-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 78.