http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105087182-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fb9f44db08d1c42a53f3d28eaae416f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-28 |
| filingDate | 2015-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_195cb7fa63b79b461e20c4ee02096604 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5480bb069821dbd014e03dafca9d6c52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_407ad1963c168576ea5db5c8fc5ac7ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e00acdd181838f45552325f99fc03bca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_914e5e57b8e2adcf542a06939b1d887c |
| publicationDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105087182-A |
| titleOfInvention | Method for producing circuit board on which solder is solidified and circuit board on which electronic components are mounted, and cleaning agent composition for flux |
| abstract | The present invention provides a method of manufacturing a circuit board with solder solidified, which can suppress the soldering of the electrodes that have not been solidified by the solder after a step of solidifying the solder on the other part of the electrodes without solidifying the solder on the circuit board. Discoloration. A method of manufacturing a circuit board including the following steps (1) to (4). (1) A step of treating the metal conductive part of the circuit board having the electrodes to form the circuit in the first region and the second region of the supporting base material with the metal treating agent A. (2) A step of hardening the solder after applying flux B and solder to the electrodes of the first region of the circuit board obtained in the step (1). (3) A step of cleaning the circuit board obtained in the step (2) from flux residues using a cleaning agent C containing a glycol ether, an alkanolamine, and an imidazole compound represented by the following general formula (I). (4) A step of hardening solder on the electrodes in the second region of the circuit board after the step (3). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113165027-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108349049-A |
| priorityDate | 2014-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.