Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ed2a6e6c00447811257412836478db0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-818 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-144 |
filingDate |
2014-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cd8c6a229b894d2aec37a08f110c4e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee1d3f081bbabeb48680c2fc63f12b2b |
publicationDate |
2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-104701344-A |
titleOfInvention |
Optoelectronic component and a method for manufacturing an optoelectronic component |
abstract |
Various embodiments relate to an optoelectronic component including: an electronic circuit structure including an electronic circuit and a metallization structure disposed over the electronic circuit, the metallization structure including one or more contact pads electrically connected to the electronic circuit; and an optoelectronic structure disposed over the metallization structure, the optoelectronic structure including at least one electrode structure being in direct contact with the one or more contact pads, wherein the electrode structure includes an electroless plated electrically conductive material. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106654057-A |
priorityDate |
2013-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |