| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F17-50 |
| filingDate |
2012-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103548028-B |
| titleOfInvention |
Interconnection structure and the method being used for building interconnection structure |
| abstract |
In one embodiment, a kind of integrated circuit (IC) interconnection structure between chip and substrate includes multiple material.It is to be determined by the stress being associated of this structure for the material of different sections of interconnection structure and their layout and selects. |
| priorityDate |
2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |