| abstract |
It is an object of the invention to provide a kind of adhesive tape for wafer processing, it does not produces skew at bond layer with adhesive phase interface because of expansion, has the homogeneous dilatancy being suitable to cut off the operation of bond layer, and pick is excellent.In the present invention, use adhesive tape for wafer processing, this adhesive tape for wafer processing is characterised by, the adhesive phase by base film, being formed on above-mentioned base film and the bond layer being formed on above-mentioned adhesive phase are constituted, and above-mentioned adhesive phase and above-mentioned bond layer shearing force at 25 DEG C are 0.2N/mm 2 Above, at 200mJ/cm 2 Energy line irradiate after according to the peeling rate under the standard state of JIS Z0237 be 300mm/min, peel angle be 180 ° time the peeling force of above-mentioned adhesive phase and above-mentioned bond layer be below 0.3N/25mm. |