http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103391686-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103391686-B |
| titleOfInvention | Wiring board processing method |
| abstract | The embodiment of the invention discloses a kind of Wiring board processing method, including line pattern transfer step: after light-sensitive surface is sticked on the surface of the wiring board with metal level of line pattern to be produced, wiring board is exposed and the line pattern designed is transferred on light-sensitive surface by the mode developed；Plasma treatment step: the burr formed in the edge of solidification light-sensitive surface after using plasma apparatus removal developed；Etching step: etch conductive circuit pattern on plate face.The Wiring board processing method of the present invention, uses plasma apparatus to remove the burr formed at the edge on light-sensitive surface limit before conducting transmission line etching, can improve development analytic ability, and then improve line pattern machining accuracy. |
| priorityDate | 2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.