http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102870198-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-427
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2010-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102870198-B
titleOfInvention Pole low silicon loss high dose implantation is peeled off
abstract The present invention is provided to peeling off photoresist from workpiece surface and removing the improved method that related residue is ion implanted.According to various embodiments, plasma is produced using element hydrogen, fluoro-gas and protective agent gas.Reacted with high dose implantation resist through plasma-activated gas, so as to remove both crust and block resist layer, and protect the expose portion of the workpiece surface simultaneously.In the case of low silicon loss, the workpiece surface is substantially free from residue.
priorityDate 2009-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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