| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_747b6e29d9ac02899dbc90b4cde0dac6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66803 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32706
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2236 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate |
2010-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd61c0921efa9e05918ea7c6706963b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b5c64ef5592dfd715a68db63efd1ed9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d38f43e57f1eb2348b145b67383c6286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47ed25756f628ecc50b966246ca08b25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6560a76766fe84b8a67db7910792aeb7 |
| publicationDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102598219-B |
| titleOfInvention |
A technique for processing a substrate having a non-planar surface |
| abstract |
A method of processing a substrate having horizontal and non-horizontal surfaces is disclosed. The substrate is implanted with particles using an ion implanter. During the ion implant, due to the nature of the implant process, a film may be deposited on the surfaces, wherein the thickness of this film is thicker on the horizontal surfaces. The presences of this film may adversely alter the properties of the substrate. To rectify this, a second process step is performed to remove the film deposited on the horizontal surfaces. In some embodiments, an etching process is used to remove this film. In some embodiments, a material modifying step is used to change the composition of the material comprising the film. This material modifying step may be instead of, or in addition to the etching process. |
| priorityDate |
2009-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |