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grantDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102574676-B
titleOfInvention Process for manufacturing MEMS devices having buried cavities and MEMS device obtained thereby
abstract A process for manufacturing a MEMS device, wherein a bottom silicon region (4b) is formed on a substrate and on an insulating layer (3); a sacrificial region (5a) of dielectric is formed on the bottom region; a membrane region (21), of semiconductor material, is epitaxially grown on the sacrificial region; the membrane region is dug as far as the sacrificial region so as to form through trenches (15); the side wall and the bottom of the through trenches are completely coated in a conformal way with a porous material layer (16); at least one portion of the sacrificial region is selectively removed through the porous material layer and forms a cavity (18); and the through trenches are filled with filling material (20a) so as to form a monolithic membrane suspended above the cavity (18).
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Total number of triples: 23.