| abstract |
The invention discloses heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) a compound having a long apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins, d) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150 DEG C, and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1. |