| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f24c224ae693f31afc3fc950c683de97 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-001 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
1999-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2bcd8db5c002b6b9d33f95e0baadaca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5c2bbd90fcdbb0c0e0940e3ae2e4209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9845e19b5709751142386d381d4c2bab |
| publicationDate |
1999-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9964647-A1 |
| titleOfInvention |
Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly |
| abstract |
Simultaneous non-contact plating and planarizing of copper interconnections (181) in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode (510, 570) and a metallized surface of a semiconductor wafer (430) without necessary physical contact with the wafer or direct electrical connection thereto. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10023970-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9909228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7427337-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7854828-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8858774-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9752248-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9260793-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9988733-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11549192-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004044273-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10920335-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9822461-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7578923-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10017869-B2 |
| priorityDate |
1998-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |