| abstract |
A method and a device for plating a substrate capable of filling a material with a small electrical resistance such as copper or copper alloy into fine recesses such as fine wiring grooves solidly, uniformly and with flat surfaces; specifically, a method for plating a substrate which electroplates a substrate (W) having fine grooves (10) therein and fills metal (13) into the fine grooves (10), wherein a first step plating (11) is carried out with the substrate (W) immersed in a first plating liquid having a composition very uniform in eletrodepositing performance and then a second step plating (12) is carried out while immersed in a second plating liquid having a composition excellent in levelling performance. |