| abstract |
A semiconductor device which can be directly connected to a board while securing the reliability of connection without adding any step after the selection of a board material and the connection and which contributes to reduction in size and weight of an electronic apparatus. The semiconductor device includes a semiconductor chip (100) having an electrode (104), a wiring layer (120) connected to the electrode (104), a contact layer (122) provided on the wiring layer (120) in a position avoiding the electrode (104), an underlying metal layer (124) provided on the contact layer (122), having a size larger than the contour of the contact layer (122) and more deformative than the contact layer (122), a bump (200) provided on the underlying metal layer (124), and a resin layer (126) provided around the contact layer (122). A method for manufacturing the device, a circuit board, and an electronic apparatus are also disclosed. |