patent/WO-9918766-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9918766-A1

Outgoing Links

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filingDate	1998-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fc4196469385bd07a3592fa8ae0d23c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d34429a9dde43bb26e19b395e539db72
publicationDate	1999-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	WO-9918766-A1
titleOfInvention	Method for mounting semiconductor element to circuit board, and semiconductor device
abstract	The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive (107) is applied to an opposite face (101a) of a circuit board (101). The circuit board is then connected with a semiconductor element (103) by a conductive adhesive (106) and the insulating adhesive which are interposed between an electrode (102) on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014211545-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10110999-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0215659-A1
priorityDate	1997-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 86.