| abstract |
A highly radiation-sensitive resist composition which can form a highly heat-resistant resist image. This resist composition comprises a resist material and a polymer obtained by reacting (a) a xylylene compound, (b) salicylic acid, and (c) a 9,9'-bis(hydroxyphenyl)fluorene or a 3,3,3',3'-tetramethyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindenediol and having a weight-average molecular weight of 1,000 to 5,000 and a Tg of 100 to 150 °C. Examples of the ingredient (c) include 9,9'-bis(4-hydroxyphenyl)fluorene and 3,3,3',3'-tetramethyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindene-6,6'-diol. Although the resist material may be either of positive and negative resists, it preferably comprises an alkali-soluble resin and a quinonediazide sensitizer. |