Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_433f8e8d0240971fcd2c7b8d1b3064f2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43ff86555af01587923a24854255a7ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67eb779cc39347ed21b5e06fedb658b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cb0a6b3b7114fbaa453916b656cf31c5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2170-20 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J149-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-698 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-12 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J149-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-14 |
filingDate |
1998-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dfc0c0b40439b09dbb865dae08732e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93f8a3730208e5fe42aeabb205aff0f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96cda63f0a58d1bb2d0a5f1ccbfe01c4 |
publicationDate |
1998-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-9854270-A1 |
titleOfInvention |
Hxdroxylated polydiene based hot-melt adhesive compositions |
abstract |
The invention concerns hot-melt adhesive (HMA) compositions in the form of polymer containing free isocyanate functions, said polymer resulting from the reaction of a polyisocyanate (A), a polyol polydiene (B) and an ethylene copolymer (C) containing hydroxyl functions. Said adhesives have a low viscosity and can therefore be used as from 110 DEG C and they are moisture-setting. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001329248-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1754765-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4618620-B2 |
priorityDate |
1997-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |