| abstract |
A semiconductor sealing resin composition which is excellent in not only safety but also moisture resistance and flame retardancy and, in addition, moldability; and a highly reliable semiconductor device prepared by sealing a semiconductor element with the sealing resin composition. The resin composition comprises a thermosetting resin, a curing agent, and, further, a polyhedral composite metal hydroxide represented by the following general formula (1): m(MaOb).n(QdOe).cH2O wherein M and Q are different from each other and each represents a metal element with Q representing a metal element selected from among the group IVa, Va, VIa, VIIa, VIII, Ib, and IIb metal elements; and m, n, a, b, c, d, and e, which may be the same or different, represent each a positive number. The resin composition can prevent a lowering in fluidity thereof, does not pose any problem at the time of transfer molding, and improves the moldability. Further, not only the soldering properties but also the mechanical strengths can be improved. |