| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_260220c525b214105ee48ee2d77a5bf4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0551 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
1998-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6015a169e74e67c44067f02b787bd0de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2af0bce9b5a264dde604c193fcd5a43d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd9000bc1737ad977a5b8688397e7b18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1890ac762fad218fd1eee8ad57eb267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71a023dabb1b959b9c79f3040603ddcc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4ac2f34076e2b6377a9e0fbc63143a9 |
| publicationDate |
1998-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9847332-A1 |
| titleOfInvention |
Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards |
| abstract |
High density built-up multilayer printed circuit boards are produced by constructing microvias with positive working photoimageable dielectric materials. A positive working photosensitive dielectric composition (4) on a conductive foil (2) is laminated to conductive lines (6) on a substrate (8). After imaging the foil (2), and imaging and curing the photosensitive dielectric composition (4), vias (14) are formed to the conductive lines (6). Thereafter the conductive lines (6) are connected (16) through the vias (14) to the conductive foil (2), and then the conductive foil (2) is patterned. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1440931-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1440931-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0133925-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0028798-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1062849-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1062849-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6711813-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100384769-B1 |
| priorityDate |
1997-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |