| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46435b49a3b809cefdf9fcd824c98dda |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate |
1997-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f6a32f982c5e4a024f580d91afd580 |
| publicationDate |
1998-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9820558-A1 |
| titleOfInvention |
Electronic package having reduced radius of curvature |
| abstract |
An integrated circuit assembly (124) includes a chip interconnect circuit (126) and an integrated circuit die (132). The chip interconnect circuit is formed from a substrate having a thickness of between 5 mils (127 mm) and 25 mils (635 mm). The integrated circuit die is bonded to the chip interconnect circuit, and has a thickness of 25 mils (635 mm) or greater. |
| priorityDate |
1996-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |