| abstract |
Sputter coating apparatus includes a plasma generating means (3) for generating fluxes and a plasma (5), including one or more of infrared, visible, ultra violet and/or microwave radiation, and ionic, electronic, neutral atom and/or molecular fluxes including fluxes of atoms, molecules or particles sputtered from any target which may be adjacent to the plasma. The apparatus further includes a support (7) for holding material (8) which is to be subject to the fluxes, and a filter (10) located between the plasma and the support, for selectively modifying the relative proportions of the various fluxes incident on the material. |