| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d724dd3ea4c1acec03222b5cfc11a51e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a430177694312ab817b08a9b1d24470 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32 |
| filingDate |
1996-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea0c8758765dd15ff1c04011f75aa45a |
| publicationDate |
1997-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9714826-A1 |
| titleOfInvention |
Tin plating electrolyte compositions |
| abstract |
There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low current density (component b), one or more addition agents, a tin source, water. There are also described methods of tin plating by the compositions of the invention. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6143160-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0017420-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0017420-A2 |
| priorityDate |
1995-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |