| abstract |
A low RC delay interconnection pattern is formed with a low resistivity metal (22), such as copper, and a low dielectric constant material (21), such as organic polymers. An intermediate bonding layer (23) is formed between the low resistivity metal (22) and low dielectric constant material (21) employing an adhesion promoter, such as a silane-based adhesion promoter. The adhesion promoter (23) can be applied between the metal (22) and dielectric layers (21) or incorporated in the dielectric layer. |