| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_023012b22a4004742c4e55a477ae9ea9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03f5939870228d494b7fb454e8c47625 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07728
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07747 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077 |
| filingDate |
1996-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72faa9640d383aded1d3b096e5d1f50b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e51d3a4e384d284dcff59c2f0072f903 |
| publicationDate |
1996-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9632696-A1 |
| titleOfInvention |
Ic card and ic module |
| abstract |
An IC card (1) comprising a card base (2) and an IC module (10) fitted into a recess (3) in the base. The IC module (10) includes a substrate (11), a terminal portion (15) disposed on one of the surfaces of the substrate (11) and an IC chip (12) and a frame member (14) disposed on the other surface of the substrate (11). A seal resin (13) for sealing the IC chip (12) is packed into the frame member (14). The deformation per unit length of the substrate (11) under a predetermined load is greater than that of the card substrate (2). When a bending stress is applied to the IC card (1), the frame member (14) and the seal resin (13) protect the periphery of the IC chip (12) but allow the substrate (11) other than the periphery of the IC chip (12) to undergo great deformation so as to absorb the bending stress. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100330651-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013206122-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9727625-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007148672-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9829906-A1 |
| priorityDate |
1995-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |