| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac93f643b44e958763fd1234fe359e3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
1995-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eb9f5f19b3e90def30d368d4b7c7ced
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb8e16e4e89afa44cea634102ae227f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9184eb975777a958d45839f307bbc5eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc712f0b2cb642c83fb287dff08c7688 |
| publicationDate |
1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9619734-A1 |
| titleOfInvention |
Method and apparatus for semiconductor die testing |
| abstract |
A test apparatus for testing a known-good die integrated circuit (10) is disclosed. The test apparatus uses conductive straps (18) extending across trenches (20). The straps (18) align with bond pads (14) on the integrated circuit (10). When the bond pads (14) are brought into contact with the straps (18), the straps (18) exert a counterforce in the opposite direction to ensure a good electrical contact while testing the integrated circuit. |
| priorityDate |
1994-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |