| abstract |
In a semiconductor device comprising an IC chip (8) mounted an a circuit substrate (7) and sealed with a molding resin (11), corner resist films (6a, 6b, 6c, 6d) are formed at positions corresponding to a corner (A) of the IC chip (8) on the circuit substrate (7), and the corner (A) of the IC chip (8) is bonded to these corner resist films by using a die bond (9). A die pattern (3a) is exposed outside the corner resist films, and a power supply pattern (3b) is so formed as to encompass their periphery. The power supply terminal, the die pattern (3a) and the power supply pattern (3b) are connected by bonding wires (10). In this way, the adhesion strength of the corner of the IC chip is improved and peel is prevented. Furthermore, bonding of a large number of bonding wires for power supply can be freely made. |