| abstract |
The present invention seeks to provide an improved packaged integrated circuit including: a silicon substrate (10), at least one metal layer (16) formed on the silicon substrate and defining a plurality of pads, at least one packaging layer (12) formed over the at least one metal layer, a plurality of solder leads (20) formed on an exterior surface (22) of the at least one packaging layer, and electrical connections (19) extending directly from individual ones of the plurality of pads to individual ones of solder leads. |