| abstract |
There is provided a base (12') for an electronic package (50). The base (12') includes a peripheral portion for a polymer adhesive (26) and a central portion for one or more semiconductor devices. A lead support (52) is located between the peripheral portion and the central portion. When a polymer adhesive (26) bonds a leadframe (16) to the package base (12'), the lead support (52) prevents deflection of the inner lead tips (18). |