| abstract |
Described is a mixture of an adduct of an epoxy resin and a novolak with an acrylic-ester polymer, a modified bisphenol A or a polyol, the mixture giving, with a polyisocyanate or a polyol made from an OH-terminated polyurethane or polyester, a heat-sealing adhesive with high temperature resistance and high resistance to hydrolysis, together with relatively high composite-bonding characteristics. The composition is therefore particularly suitable for use as a substrate material and cover film for printed circuits. |