| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10992
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-007 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
1994-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc31d80c5e457bc972603e279b087ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3e98678a8dc7a2691722316d4b573e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d101710e87432b0fd03369b77187143 |
| publicationDate |
1994-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9423555-A1 |
| titleOfInvention |
Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
| abstract |
In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection. |
| priorityDate |
1993-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |