| abstract |
There is provided a leadframe assembly (40) for supporting a hybrid circuit (42). The hybrid circuit (42) is supported by either the base (12) of an electronic package (70) or by a die attach paddle (20) and electrically interconnected to a leadframe (16) by wire bonds (28). A plurality of semiconductor devices (24) are mounted on the assembly (40) and supported by either metallization pads (46') formed on the hybrid circuit (42), a dielectric layer (44) of the hybrid circuit (42), a die attach paddle (20), a metallic package component (12) or combinations thereof. |