| abstract |
A method for attaching an integrated circuit component (10) to a printed circuit board (12) by a plurality of solder bump interconnections (40) utilizes a printed circuit board comprising a solder-plated circuit trace. The trace includes terminals (20), each including a terminal pad (22) and a runner section (24). A solder plate (28) formed of a first solder alloy is applied to the terminal to extend continuously between the pad and the runner section. Solder bumps (30, 32) formed of second compositionally distinct solder alloy having a melting temperature greater than the first alloy are affixed to the component. The component and board are then assembled so that the bump (30) rests against the solder-plated terminal pads, and heated to a temperature effective to melt the solder plate but not the bump alloy. Upon cooling to resolidify the solder, the solder plate is fused to the bumps to form the interconnections. |