| abstract |
The reactive hot-melt adhesive proposed contains, as the resin component, a reaction product of a) 0.5 to 1 equivalent of an epoxy resin produced from bisphenol A and/or bisphenol F and epichlorohydrin, which is solid at room temperature and which has an epoxy equivalent weight of 400 to 700; b) 0.5 to 1 equivalent of an epoxy resin produced from bisphenol A and/or bisphenol F and epichlorohydrin, which is liquid at room temperature and which has an epoxy equivalent weight of 150 to 200; c) 0.125 to 0.5 equivalent of amino-terminated polymers of ethylene glycol and/or propylene glycol. |