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filingDate 1991-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53f502af4c8885a114d2cca867795b5c
publicationDate 1992-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-9207675-A1
titleOfInvention Binder system and process for treating metal powder by injection moulding
abstract For the Metal Injection Moulding method, a binary binder system as described for solid polymer solutions is proposed together with a process for the production of mouldings of sintered metal powders using the binder system of the invention. It is distinguished by the use of physiologically acceptable low-molecular binder components and the abandonment of wetting agents. The use of the binder system of the invention makes it possible to produce highly filled mouldings with metal powder easily by injection moulding and to remove the binder therefrom in a short time without dimensional changes. After the remaining metal powder structure has been sintered, high-grade parts are obtained.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2030957-A1
priorityDate 1990-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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