| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49586
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49579 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
1991-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84f9e8ef685484a274ef2768ed31ea65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6ae02ffb4de7ca9e0bf52849e939ac0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1b429a7be473b91ddf36b4eafd8403e |
| publicationDate |
1992-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9204729-A1 |
| titleOfInvention |
Leadframe for molded plastic electronic packages |
| abstract |
A composite leadframe (10) for an electronic package (32') is provided. The leadframe (10) has an electrically conductive core (35) with a polymer layer (42) coating a portion of the core (35) to increase the adhesive bond between leadframe (10) and molding resin (34). The improved adhesion prevents water vapor from accumulating under the leads (18) and die attach paddle (24) thereby minimizing the popcorn effect. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3038114-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016102210-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005071741-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005071741-A2 |
| priorityDate |
1990-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |