| abstract |
The description relates to reactive systems for bonding and/or coating substrates, especially for heat-seal coatings, based on aqueous dispersions of an epoxy-curable resin (I) and epoxy compounds as the hardening agents (II). The use of polyurethane polymers with functional groups reactive to epoxies as the hardenable resin (Ia) results in monolithic heat-seal-coated substrates which may, for instance, be further processed to provide flexible printed circuits. |