| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8730ca694d8bb691b24e3036224f5b4a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F292-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J151-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J151-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F292-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10 |
| filingDate |
1990-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c1bb473883d7eec5fd5f4494c374b98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b9acbc1d46872529318eac7f338f2a1 |
| publicationDate |
1991-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9108575-A1 |
| titleOfInvention |
Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| abstract |
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; c) at least one free radical initiator for polymerizing said unsaturated monomer; and d) finely divided silver particles. |
| priorityDate |
1989-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |