| abstract |
In a semiconductor device sealed with a resin in which a semiconductor chip (1) is connected to externally connecting lead wires (7) via electrically conductive members, and the surface of the semiconductor chip and at least portions of the electrically conductive members close to the semiconductor chip are covered with a cured silicone layer (5a), the improvement wherein the surface of the cured silicone layer is treated with ozone or is irradiated with ultraviolet rays in addition to being treated with ozone, and the surface of said cured silicone layer treated with ozone or irradiated with ultraviolet rays in addition to being treated with ozone, is adhered to the sealing resin (6a) that covers thereon. The invention is further related to a method of producing such devices. |